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1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

Thông tin chi tiết sản phẩm:

Place of Origin: CHINA
Hàng hiệu: Civen
Chứng nhận: CTI
Model Number: MGP-HR0718006

Thanh toán:

Minimum Order Quantity: 100kg
Giá bán: negotiation according to the sizes
Packaging Details: Packed in strong wooden case suit for exporting
Delivery Time: 16working days after received your deposit
Payment Terms: T/T
Supply Ability: 560M/T per month
Liên hệ với bây giờ
Chi tiết sản phẩm
Purity: ≥99.8% Alloy Number: C11000(T2)
Thickness: 1oz/0.035mm Area Weght: Customized
Application: FPC Width Range: 550~1295mm(21.65~51inch)
Surface: One side shiny and one side matte

 

1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

 

 

1.Description

CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).

 

2.Specifications:

 Thickness:1OZ(0.035MM)

Width:150~1290mm

 

3.Performance:

Classification Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content % ≥99.8
Area Weigth g/m2 80±3 107±3 127±4 153±5 283±5 585±10
Tensile Strength R.T.(25℃) Kg/mm2 ≥28 ≥30
H.T.(180℃) ≥15
Elongation R.T.(25℃) % ≥4.0 ≥5.0 ≥6.0 ≥10
H.T.(180℃) ≥4.0 ≥5.0 ≥6.0
Roughness Shiny(Ra) μm ≤0.4
Matte(Rz) ≤5.0 ≤6.0 ≤7.0 ≤7.0 ≤9.0 ≤14
Peel Strength R.T.(23℃) Kg/cm ≥1.0 ≥1.2 ≥1.2 ≥1.3 ≥1.8 ≥2.0
Degraded rate of HCΦ(18%-1hr/25℃) % ≤5.0
Change of color(E-1.0hr/190℃) % Good
Solder Floating 290℃ Sec. ≥20
Pinhole EA Zero
Preperg ---- FR-4

 

1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

Chi tiết liên lạc
Civen Metal Material(Shanghai) Co.,Ltd

Người liên hệ: Mr. Duearwin Moon

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