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Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

    • Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc
    • Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc
  • Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

    Thông tin chi tiết sản phẩm:

    Place of Origin: China
    Hàng hiệu: Civen
    Chứng nhận: ISO 9001 CERTIFICATE
    Model Number: MGP-TRA021022

    Thanh toán:

    Minimum Order Quantity: 1000 KG ( 2205 LB )
    Giá bán: Negotiate
    Packaging Details: Strengthen Cardboard Inner Core And Exporting Wooden Case
    Delivery Time: 10-15DAYS
    Payment Terms: T/T
    Supply Ability: 550 MT Per Month
    Liên hệ với bây giờ
    Chi tiết sản phẩm
    Material: Red Copper Ordinary Thickness: 12 um / 18 um / 35 um/70um
    Ordinary Width: Up To 600 mm ( 23.6 inch ) Matte Side: Gray Color

    Treaded RA Electrodeposited Copper Foil Thick Copper Plate For Fpc

     

    CIVEN delivers a wide range of copper and its alloy products to demanding customers in the electrotechnical industry. In the last ten years we have developed into one of the leading Chinesesuppliers of copper material. During this period we were able to make use of decades of experience from contacts with our customers, responding specifically to individual wishes and guaranteeing top-quality products.

     

    Applications:

    Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.

     

    Performances:

    High flexibility and extensibility

    Even and smooth surface

    Good fatigue resistance

    Strong antioxidant properties

    Good mechanical properties

     

    Features:

    The material has higher extensibility, and has a high bending resistance and no crack.

     

    Table 1:FPC T2 high flex rolled copper foil properties (IPC-6542)

    Item Unit Parameters
    12μm 18μm 25μm 35μm 70μm
    Mass per unit(±5%) g/m² 105 160 300 400 445
    Cu+Ag % ≥99.99
    Temper   H O,H O,H O,H O,H
    Surface roughness Ra μm 0.13 0.12 0.1 0.08 0.08
    Rz μm 1.3 1.0 0.8 0.74 0.76
    Tensile strength Normal Temp /23℃ N/mm² ≥430 ≥450 ≥450 ≥450 ≥450
    High Temp /220℃ N/mm² ≥140 ≥150 ≥170 ≥210 ≥220
    Elongation Normal Temp /23℃ % ≥1.5 ≥3.0 ≥4.0 ≥4.2 ≥4.5
    High Temp /220℃ % ≥8 ≥10 ≥18 ≥28 ≥30
    Fatigue Resistance (annealed) % 65 65 65 65 65
    Maximum resistivity Ωmm2/m 0.0181
    Electrical conductivity % ≥98.3%
    Film and adhesive layers Instant Temp. 300℃/10s Film and adhesive paste after transient temperature without blistering delamination.
    Anti oxidation H.T.(200℃) Minute Won’t Change the Color within 60 minutes
    Pinhole test results piece/ m² Pinhole area more than 0.5 mm²,0.005 piece/ m²
     

    Note: 1. Above figures based on the material with 0.05mm in thickness and 600mm in width.

    2. Normally, Copper, cobalt and nickel is coated on the rough surface.

    3. Testing method follows our company standard.

     

    Chi tiết liên lạc
    Civen Metal Material(Shanghai) Co.,Ltd

    Người liên hệ: Mr. Duearwin Moon

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